NETBPS1S102M410H5Q [TAIYO YUDEN]

RESISTOR, TEMPERATURE DEPENDENT, NTC, 1000ohm, SURFACE MOUNT, CHIP, 0603, ROHS COMPLIANT;


型号：	NETBPS1S102M410H5Q
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	RESISTOR, TEMPERATURE DEPENDENT, NTC, 1000ohm, SURFACE MOUNT, CHIP, 0603, ROHS COMPLIANT 过载保护电阻器
文件：	总7页 (文件大小：826K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

積層チップNTCサーミスタ

MULTILAYER CHIP NTC THERMISTORS

OPERATING TEMP.

K55VJ125C

＊1005TYPEを除く

＊Except for 1005TYPE

特長ꢀFEATURES

Y125C保証

YGuaranteed up to 125C.

YB定数が大きく温度検知能力が優れている

Y表裏の区別がなくバルク、テーピングでの自動装着が可能

Y寸法はEIAJ規格に準拠

YLarge B constant for higher temperature sensing capability.

YIdeal for automatic mounting in bulk or from tapes because of front-rear

symmetry.

Y内部電極構造を採用することにより、信

頼性向上を実現しています

YAvailable in a standard EIA compatible case size.

YImproved reliability due to use of internal electrodes.

用途ꢀAPPLICATIONS

Y通信

機用

YTelecommunications equipmentDmobile telephones,cellular telephones,

cordless telephones, etc.

YOffice automationDprinters, facsimiles, word processors, etc.

YConsumer electronicsDVCRs, color television sets, LCD television sets,

CD players, etc.

自動車電話、携帯電話、コードレス電話ほか

YOA機器用

プリンタ、ファクシミリ、ワードプロセッサほか

Y民生機器用

ビデオ、カラーテレビ、液晶

テレビ、CDプレーヤほか

YBattery protection circuit

Yバッテリ保護回路用

形名表記法ꢀORDERING CODE

公称 B 定数 [K]

最低温度 [C]

形式

公称零負荷抵抗 [E]

寸法 [mm]

例

1.0P0.5f0402g

例

記号P10

K55

NTC サーミスタ

1000

102

154

1.6P0.8f0603g

295

410

2950

4100

150000

最高温度 [C]

形状

包装

メッキ電極品

ꢀ

125

抵抗許容差 [L]

B 定数許容差 [L]

紙テーピング

単品f袋づめg

当社管理記号

標準品

M10

M20

ꢀꢀꢀꢀQ= スペース

○�

T B P S 1 S 1 0 3 K 4 4 0 H 5 Q

Nominal B constant[K]

Min. temperature[C]

Type

Nominal Zero-Power Resistance[E]

Dimension[mm]

example

1.0P0.5f0402g

SymbolP10

K55

NTC THERMISTOR

Plated terminal

1000

150000

102

154

1.6P0.8f0603g

295

2950

410

4100

Max. temperature[C]

Shape

ꢀ

125

Packaging

Resistance tolerance[L]

B constant tolerance[L]

Tape&Reel

Bulk

Internal code

Standard product

M10

M20

ꢀꢀꢀꢀQ=Blank space

504

外形寸法ꢀEXTERNAL DIMENSIONS

Type

0.5M0.05

0.25M0.10

1.0M0.05

1005 f0402g

f0.020M0.002g

0.8M0.15

f0.020M0.002g

0.8M0.15

f0.010M0.004g

0.35M0.25

f0.039M0.002g

1.6M0.15

1608 f0603g

f0.031M0.006g

f0.014M0.010g

f0.063M0.006g

Unit:mm fInchg

R-T特性図ꢀR-T CHARACTERISTICS

1005typef0402g

1608typef0603g

仕様ꢀSPECIFICATIONS

許容差（記号）Tolerance fSymbolsg

R25

M1%fFg, M2%fGg, M3%fHg, M5%fJg, M10%fKg, M20%fMg

Ｂ定数

B Constant

M1%fFg, M3% fHg

セレクションガイド

Selection Guide

アイテム一覧

Part Numbers

特性図

Electrical Characteristics

梱包

Packaging

信

頼性

使用上の注意

Reliability Data

Precautions

※

P.14

etc

P.506

P.507

P.508

P.510

※営業窓口に御相談ください。Please contact our Sales Department.

505

アイテム一覧ꢀPART NUMBERS

1005TYPE

EHS

(Environmental

Hazardous

B定数

熱時定数熱放散定数

Thermal time Dissipation

形ꢀ名

R25

定格電力

備ꢀ考

B constant

Ordering Code

[kE]

Rated Power

Remark

constant

factor

Substances)

fK:25/85Cg fK:25/50Cg

T B P S 0Z2 2 2

4 1 0 H 5 Q

RoHS

2.2

3.3

4.7

6.8

4100

4400

4550

4034

4336

4483

T B P S 0Z3 3 2

T B P S 0Z4 7 2

T B P S 0Z6 8 2

T B P S 0Z1 0 3

T B P S 0Z1 5 3

T B P S 0Z2 2 3

T B P S 0Z3 3 3

T B P S 0Z4 7 3

T B P S 0Z6 8 3

T B P S 0Z1 0 4

T B P S 0Z1 5 4

4 1 0 H 5 Q

4 4 0 H 5 Q

4 5 5 H 5 Q

0.5V2.0

mW/C

T3 sec

35mW

100

150

形名の○には包装（R=テーピング、S=単品）、△には抵抗許容差記号（J,K,M）が入ります。

ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance codefJ, K, Mg.

1608TYPE

EHS

(Environmental

Hazardous

B定数

熱時定数熱放散定数

Thermal time Dissipation

形ꢀ名

R25

定格電力

備ꢀ考

B constant

Ordering Code

[kE]

Rated Power

Remark

constant

factor

Substances)

fK:25/85Cg fK:25/50Cg

T B P S 1Z4 7 0

2 9 5 H 5 Q

RoHS

0.047

0.068

0.100

0.150

0.22

0.33

0.47

0.68

1.0

2950

3150

4100

4400

4600

2934

3157

4034

4336

4533

4642

3395

T B P S 1Z6 8 0

T B P S 1Z1 0 1

T B P S 1Z1 5 1

T B P S 1Z2 2 1

T B P S 1Z3 3 1

T B P S 1Z4 7 1

T B P S 1Z6 8 1

T B P S 1Z1 0 2

T B P S 1Z1 5 2

T B P S 1Z2 2 2

T B P S 1Z3 3 2

T B P S 1Z4 7 2

T B P S 1Z6 8 2

T B P S 1Z1 0 3

T B P S 1Z1 5 3

T B P S 1Z2 2 3

T B P S 1Z3 3 3

T B P S 1Z4 7 3

T B P S 1Z6 8 3

T B P S 1Z1 0 4

T B P S 1Z1 5 4

T B P S 1Z1 0 3

2 9 5 H 5 Q

3 1 5 H 5 Q

4 1 0 H 5 Q

4 4 0 H 5 Q

4 6 0 H 5 Q

4 7 5 H 5 Q

3 4 4 F 5 Q

1.5

2.2

1.0V2.5

mW/C

T5 sec

63mW

3.3

4.7

6.8

4600

4750

3435

100

150

形名の○には包装（R=テーピング、S=単品）、△には抵抗値許容差記号（J, K, M（TBP S1 Z 103 Q 344 F 5QはF,GまたはH））が入ります。

ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance code (F,G or H for TBP S1 Z 103 Q 344 F 5Q J, K or M for

ꢀother part numbers).

506

特性図ꢀELECTRICAL CHARACTERISTICS

1005typef0402g

高温放置ꢀHigh Temperature Life Test

試験条件ꢀTest Condition 125C

耐湿性 Damp Heatfsteady stateg

試験条件ꢀTest Condition 85C95%

1608typef0603g

高温放置ꢀHigh Temperature Life Test

試験条件ꢀTest Condition 125C

耐湿性 Damp Heatfsteady stateg

試験条件ꢀTest Condition 85C95%

507

梱包ꢀPACKAGING

①最小受注単位数 Minimum Quantity

④リーダー部・空部 Leader and Blank portion

製品厚

み

形ꢀ式

標準数量 Standard quantity [pcs]

Thickness

Type

袋づめ Bulk

10000

紙テープ Taping

10000

[mm]

1005 (0402)

0.5 (0.020)

1608 f0603g

0.8 f0.031g

2000

4000

②テーピング材質 Tape material

160mm以上

6.3inches or more

100mm以上

f3.94inches or moreg

引き出し方向

Direction of tape feed

400mm以上

f15.7inches or moreg

⑤リール寸法 Reel size

2.0M0.5

f0.079M0.031g

B13.0M0.2

f0.512M0.020g

UnitDmm fInchg

③テーピング寸法 Taping Dimensions

⑥トップテープ強度 Top Tape Strength

紙テープ（8mm幅）Paper tapef0.315inches wideg

トップテープのはがし力は下図矢印方向にて0.1～0.7Nとなります。

The top tape requires a peel;-off force of 0.1V0.7N in the direction of the

arrow as illustrated below.

チップ挿入部

挿入ピッチテープ厚

み

形ꢀ式

Type

Chip cavity

Insertion pitch Tape thickness

0.65M0.1

1.15M0.1

2.0M0.05

0.8max

1005f0402g

1608f0603g

f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg

1.0M0.2

1.8M0.2

4.0M0.1

1.1max

f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg

UnitDmmfInchg

508

1/2

RELIABILITY DATA

MULTILAYER CHIP NTC THERMISTORS

Item

Specified Value

Test Methods and Remarks

1005(0402)

35mW

1608(0603)

63mW

K55 to J125C

1. Operating Temperature Range

2. Storage Temperature Range

3. Rated Power

2.2V150kE

M 5L

0.047V150kE

Ambient temperatureD25M0.2C

Measuring electric powerD0.1mW max.

4. Nominal Zero-Power Resistance

5. Nominal B Constant

M 5L

M 10L

M 20L

M 10L

M 20L

4100V4550K

M3L

2950V4750K

M3L

Measure the resistance at the ambient temperatures of 25M0.2C and J85M0.2C.

0.5 to 2.0mWNC

1.0 to 2.5mWNC

This represents the amount of electric power required to raise the temperature of

6. Dissipation Constantfsingle unitg

7. Thermal Time Constantfsingle unitg

the element by 1C through self-heating under thermal equilibrium.

Within 3 sec.

Within 5 sec.

This represents the amount of time for the temperature of the thermistor element to

change by 63.2L of the difference between the initial temperature and the ambi-

ent temperature by the drastic change of power application into thermistor from

non-zero-power to zero-power state.

25C

This represents the maximum ambient temperature at which rated power could be applied.

8. Rated Ambient Temperature

9. Electric Power Derating Curve

This represents the relations between the ambient temperature and the maximum

permissible power.

As shown in the figure at right.

R25 changeDWithin M3L

B constant changeD

Within M1L

R25 changeDWithin M5L

B constant changeD

Within M2L

WarpD2mm

10. Resistance to Flexure of Substrate

Testing boardDglass-epoxy-resin substrate

Board thicknessD0.8mm

Pressing speedD0.5mmNsec.

DurationD30 sec.

R25 changeDWithin M3L

B constant changeD

Within M1L

Applied forceD5N

DurationD10sec.

R25 changeDWithin M5L

B constant changeD

Within M2L

11. Adhesion of Terminal Electrode

511

2/2

RELIABILITY DATA

MULTILAYER CHIP NTC THERMISTORS

Item

Specified Value

Test Methods and Remarks

1005(0402)

1608(0603)

12. Solderability

According to JIS C5102 clause 8.4.

At least 75% of terminal

electrode is covered by new

solder.

At least 80% of terminal

electrode is covered by new

solder.

Solder temperatureD230M5C

DurationD4M1 sec.

Reflow solderingD

R25 changeDWithin M5L

B constant changeD

Within M2L

13. Resistance to Soldering

R25 changeDWithin M3L

B constant changeD

Within M1L

Solder temperatureD240C

DurationD5 sec.

Preheating temperatureD150C

Preheating timeD90 sec.

Number of reflowsD3 times

testing substrateDglass-epoxy-resin substrate

Conditions for 1 cycle

14. Thermal Shock

R25 changeD Within M3L

B Constant changeD

Within M1L

R25 changeD Within M5L

B Constant changeD

Within M3L

Step1DMinimum operating temperature J0／K3Cꢀ30M3 min

Step2DRoom temperatureꢀ2 to 3 min

Step3DMaximum operating temperature J0／K3Cꢀ30M3 min

Step4DRoom temperatureꢀ2 to 3 min

Number of cyclesD5

RecoveryD2 to 3 hrs of recovery under the standard condition after the test.

TemperatureD125M2C

DurationD1000M12 hrs

R25 changeD Within M3L

B Constant changeD

Within M1L

R25 changeD Within M5L

B Constant changeD

Within M3L

15. High Temperature Life Test

RecoveryD2 hrs of recovery under the standard condition after the removal

from test chamber.

testing substrateDglass-epoxy-resin substrate

TemperatureD85M2C

HumidityD90 to 95LRH

DurationD1000M12 hrs

R25 changeD Within M3L

B Constant changeD

Within M1L

R25 changeD Within M5L

B Constant changeD

Within M3L

16. Damp Heatfsteady stateg

RecoveryD2 hrs of recovery under the standard condition after the removal

from test chamber.

testing substrateDglass-epoxy-resin substrate

Note on standard conditionD"standard condition" referred to herein is defined as followsD

5 to 35C of temperature, 45 to 85L relative humidity and 86 to 106kPa of air pressure.

When there are questions concerning measurement resultsD

In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70L relative humidity and 86 to 106kPa of air pressure.

Unless otherwise specified, all the tests are conducted under the "standard condition."

513

NETBPS1S102M410H5Q [TAIYO YUDEN]

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